Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment
In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105....
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| Format: | Article |
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Elsevier
2018
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| _version_ | 1825721896116682752 |
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| author | Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Mahdavifard, Mohammad Hossein |
| author_facet | Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Mahdavifard, Mohammad Hossein |
| author_sort | Ali, Bakhtiar |
| collection | UM |
| description | In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag3Sn and Cu6Sn5), especially the Cu6Sn5 IMCs and a refinement in the microstructure, which is due to the existence of Bi in the alloys. Moreover, the existence of Fe and Bi gives the microstructure better stability under severe thermal aging conditions. The tensile testing results showed that the addition of Fe and Bi to SAC105 greatly improves yield stress and tensile strength, but decreases ductility level, which is because of the Bi solid solution strengthening mechanism. Under severe thermal aging, the Fe/Bi added SAC105 showed more stable tensile properties, because of the existence of both Fe and Bi in the alloys. |
| first_indexed | 2024-03-06T05:57:20Z |
| format | Article |
| id | um.eprints-22563 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:57:20Z |
| publishDate | 2018 |
| publisher | Elsevier |
| record_format | dspace |
| spelling | um.eprints-225632019-09-25T08:29:12Z http://eprints.um.edu.my/22563/ Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Mahdavifard, Mohammad Hossein TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering In this work, the iron (Fe) and bismuth (Bi) added (0.05 wt% Fe and 1 wt% or 2 wt% Bi) Sn-1Ag-0.5Cu (SAC105) lead-free solder alloys were prepared and their microstructure and tensile properties under severe thermal environments were extensively investigated and compared with the base alloy SAC105. The isothermal aging was done at 200 °C for 100 h, 200 h, and 300 h. Fe/Bi added SAC105 showed a significant reduction in the IMCs size (Ag3Sn and Cu6Sn5), especially the Cu6Sn5 IMCs and a refinement in the microstructure, which is due to the existence of Bi in the alloys. Moreover, the existence of Fe and Bi gives the microstructure better stability under severe thermal aging conditions. The tensile testing results showed that the addition of Fe and Bi to SAC105 greatly improves yield stress and tensile strength, but decreases ductility level, which is because of the Bi solid solution strengthening mechanism. Under severe thermal aging, the Fe/Bi added SAC105 showed more stable tensile properties, because of the existence of both Fe and Bi in the alloys. Elsevier 2018 Article PeerReviewed Ali, Bakhtiar and Sabri, Mohd Faizul Mohd and Said, Suhana Mohd and Sukiman, Nazatul Liana and Jauhari, Iswadi and Mahdavifard, Mohammad Hossein (2018) Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82. pp. 171-178. ISSN 0026-2714, DOI https://doi.org/10.1016/j.microrel.2018.01.015 <https://doi.org/10.1016/j.microrel.2018.01.015>. https://doi.org/10.1016/j.microrel.2018.01.015 doi:10.1016/j.microrel.2018.01.015 |
| spellingShingle | TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering Ali, Bakhtiar Sabri, Mohd Faizul Mohd Said, Suhana Mohd Sukiman, Nazatul Liana Jauhari, Iswadi Mahdavifard, Mohammad Hossein Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title | Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title_full | Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title_fullStr | Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title_full_unstemmed | Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title_short | Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment |
| title_sort | microstructural and tensile properties of fe and bi added sn 1ag 0 5cu solder alloy under high temperature environment |
| topic | TJ Mechanical engineering and machinery TK Electrical engineering. Electronics Nuclear engineering |
| work_keys_str_mv | AT alibakhtiar microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment AT sabrimohdfaizulmohd microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment AT saidsuhanamohd microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment AT sukimannazatulliana microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment AT jauhariiswadi microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment AT mahdavifardmohammadhossein microstructuralandtensilepropertiesoffeandbiaddedsn1ag05cusolderalloyunderhightemperatureenvironment |