Effects of Resin Binder on Characteristics of Sintered Aluminum–Copper Nanopaste as High-Temperature Die-Attach Material
This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for electronic applications. The Al-Cu die-attach system is formulated by a mixture of Al and Cu nanoparticles and a constituent of organic compounds and sintered at 380 °C ± 10 °C without any pressure ap...
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| Format: | Article |
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Institute of Electrical and Electronics Engineers
2019
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