Electrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron
The corrosion behavior of Fe and Bi added Sn-0.7Cu solder was investigated in 3.5 wt% NaCl solution. Addition of Fe and Bi results in higher corrosion current density, reduction in passivation and pseudo passivation domain. Formation of FeSn2 continuously forces the Sn to dissolve, forming SnCl2 and...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Published: |
Elsevier
2019
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| Subjects: |