Uniformity improvement by integrated electrochemical-plating process for CMOS logic technologies
Reliability of metal interconnects and the integration of inspection and metrology with process tools are advancing rapidly to overcome obstacles in down stream production. A significant drawback associated with metal interconnects which has resulted from the recent trend is the difficulty in obtain...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
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Elsevier
2019
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| Subjects: |