Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films
Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the r...
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| Format: | Article |
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Springer
2011
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