Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films
Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the r...
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| Format: | Article |
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Springer
2011
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| author | Haseeb, A.S. Md. Abdul Chew, C.S. Johan, M.R. |
| author_facet | Haseeb, A.S. Md. Abdul Chew, C.S. Johan, M.R. |
| author_sort | Haseeb, A.S. Md. Abdul |
| collection | UM |
| description | Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the range of 5.0-18.0 at. were prepared on copper substrate by electrodeposition in ammonia citrate bath. Solder joints were prepared on the Ni-W coated substrate at a reflow temperature of 250 A degrees C. The solder joint interface was investigated by Cross-sectional scanning electron microscopy, energy dispersive X-ray spectroscopy and electron back scatter diffraction. It has been observed that a Ni(3)Sn(4) layer with faceted morphology formed on the Ni-W alloy film after reflow. The thickness of the bright layer was found to decrease with the increase of tungsten content in the Ni-W film. An additional layer with a bright appearance was also found to form below the Ni(3)Sn(4) layer. The bright layer was identified to be a ternary phase containing Sn, W and Ni. The bright layer is found to be amorphous and is suggested to have formed through solid state amorphization caused by anomalously fast diffusion of Sn into Ni-W film. |
| first_indexed | 2024-03-06T05:14:33Z |
| format | Article |
| id | um.eprints-5497 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:14:33Z |
| publishDate | 2011 |
| publisher | Springer |
| record_format | dspace |
| spelling | um.eprints-54972019-04-16T02:51:26Z http://eprints.um.edu.my/5497/ Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films Haseeb, A.S. Md. Abdul Chew, C.S. Johan, M.R. TA Engineering (General). Civil engineering (General) Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the range of 5.0-18.0 at. were prepared on copper substrate by electrodeposition in ammonia citrate bath. Solder joints were prepared on the Ni-W coated substrate at a reflow temperature of 250 A degrees C. The solder joint interface was investigated by Cross-sectional scanning electron microscopy, energy dispersive X-ray spectroscopy and electron back scatter diffraction. It has been observed that a Ni(3)Sn(4) layer with faceted morphology formed on the Ni-W alloy film after reflow. The thickness of the bright layer was found to decrease with the increase of tungsten content in the Ni-W film. An additional layer with a bright appearance was also found to form below the Ni(3)Sn(4) layer. The bright layer was identified to be a ternary phase containing Sn, W and Ni. The bright layer is found to be amorphous and is suggested to have formed through solid state amorphization caused by anomalously fast diffusion of Sn into Ni-W film. Springer 2011 Article PeerReviewed Haseeb, A.S. Md. Abdul and Chew, C.S. and Johan, M.R. (2011) Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films. Journal of Materials Science: Materials in Electronics, 22 (9). pp. 1372-1377. ISSN 0957-4522, |
| spellingShingle | TA Engineering (General). Civil engineering (General) Haseeb, A.S. Md. Abdul Chew, C.S. Johan, M.R. Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title | Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title_full | Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title_fullStr | Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title_full_unstemmed | Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title_short | Interfacial reactions between Sn-3.5 Ag solder and Ni-W alloy films |
| title_sort | interfacial reactions between sn 3 5 ag solder and ni w alloy films |
| topic | TA Engineering (General). Civil engineering (General) |
| work_keys_str_mv | AT haseebasmdabdul interfacialreactionsbetweensn35agsolderandniwalloyfilms AT chewcs interfacialreactionsbetweensn35agsolderandniwalloyfilms AT johanmr interfacialreactionsbetweensn35agsolderandniwalloyfilms |