Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications
For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700 degr...
| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Publicado em: |
Springer Verlag (Germany)
2008
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| _version_ | 1825719143310032896 |
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| author | Haj-Taieb, M. Haseeb, A.S. Md. Abdul Caulfield, J. Bade, Klaus Aktaa, J. Hemker, K.J. |
| author_facet | Haj-Taieb, M. Haseeb, A.S. Md. Abdul Caulfield, J. Bade, Klaus Aktaa, J. Hemker, K.J. |
| author_sort | Haj-Taieb, M. |
| collection | UM |
| description | For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700 degrees C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700 degrees C. The micro-hardness values of the LIGA Ni-W layers are higher than those of the pure LIGA nickel. The micro-hardness measurements for high W-content show in addition a low decrease of the hardness values with increase of the annealing duration. Tensile tests were carried out for each composition (5 and 15 at). Ni-W shows higher strength (UTS) above 750 MPa and 1,000 MPa, respectively and lower ductility than pure nickel. |
| first_indexed | 2024-03-06T05:15:10Z |
| format | Article |
| id | um.eprints-5758 |
| institution | Universiti Malaya |
| last_indexed | 2024-03-06T05:15:10Z |
| publishDate | 2008 |
| publisher | Springer Verlag (Germany) |
| record_format | dspace |
| spelling | um.eprints-57582018-10-16T04:56:26Z http://eprints.um.edu.my/5758/ Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications Haj-Taieb, M. Haseeb, A.S. Md. Abdul Caulfield, J. Bade, Klaus Aktaa, J. Hemker, K.J. TA Engineering (General). Civil engineering (General) For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni-W layers and micro testing samples with different compositions (15 and 5 at W) were electrodeposited. In order to investigate the thermal stability the Ni-W layers were annealed at different temperatures (300-700 degrees C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700 degrees C. The micro-hardness values of the LIGA Ni-W layers are higher than those of the pure LIGA nickel. The micro-hardness measurements for high W-content show in addition a low decrease of the hardness values with increase of the annealing duration. Tensile tests were carried out for each composition (5 and 15 at). Ni-W shows higher strength (UTS) above 750 MPa and 1,000 MPa, respectively and lower ductility than pure nickel. Springer Verlag (Germany) 2008 Article PeerReviewed Haj-Taieb, M. and Haseeb, A.S. Md. Abdul and Caulfield, J. and Bade, Klaus and Aktaa, J. and Hemker, K.J. (2008) Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications. Microsystem Technologies, 14 (9-11). pp. 1531-1536. ISSN 0946-7076, DOI https://doi.org/10.1007/s00542-007-0536-5 <https://doi.org/10.1007/s00542-007-0536-5>. https://doi.org/10.1007/s00542-007-0536-5 doi:10.1007/s00542-007-0536-5 |
| spellingShingle | TA Engineering (General). Civil engineering (General) Haj-Taieb, M. Haseeb, A.S. Md. Abdul Caulfield, J. Bade, Klaus Aktaa, J. Hemker, K.J. Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title | Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title_full | Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title_fullStr | Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title_full_unstemmed | Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title_short | Thermal stability of electrodeposited LIGA Ni-W alloys for high temperature MEMS applications |
| title_sort | thermal stability of electrodeposited liga ni w alloys for high temperature mems applications |
| topic | TA Engineering (General). Civil engineering (General) |
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