Wettability of low silver content lead-free solder alloy
Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with higher Ag content showing better wettability. T...
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| Materialtyp: | Artikel |
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2009
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