Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
MDPI
2024
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