Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
In this study, a curvilinear crack phenomenon laying in the upper part of thermoelectric bonded materials subject to mechanical loadings is considered. A curvilinear crack problem in thermoelectric bonded materials subjected to shear stress is formulated. The modified complex potential (MCP) functio...
Main Authors: | Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi |
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Format: | Article |
Published: |
MDPI
2024
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