The effect of nickel doping on SAC305 lead-free solders and EN(B)EPIG surface finish
Recently, there are many portable electronics product such as i-pad, smart phone and tablet were widely used due to growing needs of busy lives and demanding, more functionalities and compatibility. The growing of these smart technologies made electronic packaging are moving parallel with current te...
| Egile Nagusiak: | , , |
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| Formatua: | Conference or Workshop Item |
| Hizkuntza: | English |
| Argitaratua: |
IEEE
2014
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| Sarrera elektronikoa: | http://psasir.upm.edu.my/id/eprint/56087/1/The%20effect%20of%20nickel%20doping%20on%20SAC305%20lead-free%20solders%20and%20EN%28B%29EPIG%20surface%20finish.pdf |