Application of artificial neural networks for the optimisation of wetting contact angle for lead free Bi-Ag soldering alloys
In the recent years, electronic packaging provides significant research and development challenges across multiple disciplines such as performance, materials, reliability, thermals and interconnections. New technologies and techniques frequently adopted can be implemented in soldering alloys of semi...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Universiti Putra Malaysia Press
2017
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| Online Access: | http://psasir.upm.edu.my/id/eprint/58327/1/17%20JST%28S%29-0286-2017-2ndProof.pdf |