Investigation of low dielectric constant (k) films for deep sub-micron CMOS application.
Silica (Si02) thin film on Si with low dielectric constant (k) properties has been systematically prepared and investigated. Two types of this low-k material have been deposited on Si via sol-gel spin-on coating. Filem nipis silika (Si02) yang berpemalar dieletrik rendah endap di atas Si tlah dis...
Main Authors: | Cheon'g, Kuan Yew, Hussain, Luay Bakir |
---|---|
Format: | Monograph |
Published: |
Universiti Sains Malaysia
2007
|
Subjects: |
Similar Items
-
Development Of Si02 Thin Film On singlecrystal Sic By anodic oxidation technique.
by: Cheong, Kuan Yew, et al.
Published: (2008) -
Anodization Of Zirconium For The Formation Of High-K Dielectric Zirconia (Zro2) Thin Film
by: Abidin, Noor Rehan Zainal
Published: (2011) -
Effect of alloying elements on properties of aluminide-base intermetallic material developed via powder metallurgy route.
by: Hussain, Zuhailawati, et al.
Published: (2007) -
Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012) -
Physical Characteristics Of Sol-gel Derived SiO2 Thick Film on 4H-SiC.
by: Jo, Lene Tan, et al.
Published: (2007)