Computational Methods In Flip Chip Assembly.
Flip chip technology, in the book edited by Lau (Lau, 1995) is defined as placing a chip to the substrate by flipping over the chip so that the I/O area of the chip is facing the substrate. By flipping over the chip, the interconnection between the chip and the substrate are achieved by conductive &...
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| Format: | Monograph |
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Universiti Sains Malaysia
2002
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