Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy
For several years, Sn-0.7Cu solder has been used in electronic packaging industries to replace the Sn-Pb solder in order to reduce the negative impact of lead to the environment and human health. However, the relatively poor wettability and mechanical properties of Sn-Cu solder alloys has raised...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2017
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| Online Access: | http://eprints.usm.my/52435/1/Effect%20Of%20Adding%20Indium%20And%20Zinc%20Alloying%20Elements%20To%20Creep%20Behavior%20Of%20Sn-0.7cu%20Solder%20Alloy_Tan%20Joo%20Kean_B1_2017.pdf |