Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin
In the modern semiconductor manufacturing processes, chemical mechanical polishing (CMP) has grown to be an essential part of the production of integrated circuit (IC) manufacturing. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mec...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf |