Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process
High demands on flexibility, lighter weight, thinner size and low cost electronic product had increases the application of Flexible Printed Circuit Board (FPCB) over Rigid Printed Circuit Board (RPCB). However, thermal factor affects significantly on FPCB during reflow soldering process. Temperature...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54244/1/Effect%20Of%20Temperature%20On%20Flexible%20Printed%20Circuit%20Board%20During%20Reflow%20Soldering%20Process_Muhammad%20Rafiq%20Mohammad%20Sabri_M4_2018.pdf |