Stress Analysis Of Stretchable Thermal Sensor

This paper present a summary of the performance of modelling for stretchable circuit. For this new technology, the stretchable board can achieve mechanically bendable and stretchable by using the elastomer based substrate and interconnect. Hence, the study on mechanical properties of substrate effec...

Szczegółowa specyfikacja

Opis bibliograficzny
1. autor: Lee, Mei Wen
Format: Monograph
Język:English
Wydane: Universiti Sains Malaysia 2017
Hasła przedmiotowe:
Dostęp online:http://eprints.usm.my/54399/1/Stress%20Analysis%20Of%20Stretchable%20Thermal%20Sensor_Lee%20Mei%20Wen_2017.pdf