Investigation Of Gold Wire Attachment During Led Encapsulation Process Using Computational Fluid Dynamic
The aim of this research is to investigate the LED encapsulation method and the interaction of gold wire bonding with EMC. The encapsulation process is important because it serves as the LED’s first layer of protection. As noted in the preceding study, the encapsulating process has an impact on prod...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2021
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| Online Access: | http://eprints.usm.my/55884/1/Investigation%20Of%20Gold%20Wire%20Attachment%20During%20Led%20Encapsulation%20Process%20Using%20Computational%20Fluid%20Dynamic.pdf |