The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg
The effect of intermetallic compound layer between Sn-4.0 Ag-0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound wer...
| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Wiley-VCH Verlag
2019
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| Subjects: |