Optimisation of hybrid microchannel heat sink with secondary channel under laminar flow condition
Nowadays, thermal management becomes one of the major bottlenecks that restrict the further development of compact electronic devices. This restriction is because of the unpredicted increment of power density in the high-density microchip, which generates high heat flux. To reduce the excessive heat...
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| Format: | Thesis |
| Language: | English |
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2022
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| Online Access: | http://eprints.utm.my/100414/1/WanMohdArifPMJIIT2022.pdf |