Layout optimization and manning ratio improvement
The objective of this study is to design a new layout for space optimization and improve manning ratio . An ergonomic new peripheral for IC bonding machine s is also designed to obtain space savings. The study is limited to the IC bonding process of one product on a single production floor of the fa...
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| Format: | Thesis |
| Language: | English |
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2010
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| Online Access: | http://eprints.utm.my/11237/1/YeongWengHarnMFKM2010.pdf |