Skip to content
VuFind
English
Deutsch
Español
Français
Italiano
日本語
Nederlands
Português
Português (Brasil)
中文(简体)
中文（繁體）
Türkçe
עברית
Gaeilge
Cymraeg
Ελληνικά
Català
Euskara
Русский
Čeština
Suomi
Svenska
polski
Dansk
slovenščina
اللغة العربية
বাংলা
Galego
Tiếng Việt
Hrvatski
हिंदी
Հայերէն
Українська
Sámegiella
Монгол
Language
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Substrate warpage analysis dur...
Cite this
Text this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Permanent link
Substrate warpage analysis during solder reflow process
Bibliographic Details
Main Author:
Beh , Keh Shin
Format:
Thesis
Published:
2004
Subjects:
TK Electrical engineering. Electronics Nuclear engineering
Holdings
Description
Similar Items
Staff View
Similar Items
Substrate warpage analysis during solder reflow process /
by: 384464 Beh, Keh Shin
Published: (2004)
Substrate Warpage analysis During Solger Reflow Process
by: Beh, Keh Shin
Published: (2004)
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
by: Mohd. Yamin, Aliff Farhan
Published: (2012)
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
by: Ariff Syakirin, Ghazalli
Published: (2007)
Interfacial reactions between lead-free solders and electroless nickel
by: Mohd. Muzamir Mahat
Published: (2009)