Substrate warpage analysis during solder reflow process
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2004
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| Subjects: |
| _version_ | 1796858205512400896 |
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| author | Beh , Keh Shin |
| author_facet | Beh , Keh Shin |
| author_sort | Beh , Keh Shin |
| collection | ePrints |
| first_indexed | 2024-03-05T19:08:59Z |
| format | Thesis |
| id | utm.eprints-42539 |
| institution | Universiti Teknologi Malaysia - ePrints |
| last_indexed | 2024-03-05T19:08:59Z |
| publishDate | 2004 |
| record_format | dspace |
| spelling | utm.eprints-425392017-09-25T12:47:49Z http://eprints.utm.my/42539/ Substrate warpage analysis during solder reflow process Beh , Keh Shin TK Electrical engineering. Electronics Nuclear engineering 2004 Thesis NonPeerReviewed Beh , Keh Shin (2004) Substrate warpage analysis during solder reflow process. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering. http://libraryopac.utm.my/client/en_AU/main/search/detailnonmodal/ent:$002f$002fSD_ILS$002f0$002fSD_ILS:386994/one?qu=Substrate+warpage+analysis+during+solder+reflow+process |
| spellingShingle | TK Electrical engineering. Electronics Nuclear engineering Beh , Keh Shin Substrate warpage analysis during solder reflow process |
| title | Substrate warpage analysis during solder reflow process |
| title_full | Substrate warpage analysis during solder reflow process |
| title_fullStr | Substrate warpage analysis during solder reflow process |
| title_full_unstemmed | Substrate warpage analysis during solder reflow process |
| title_short | Substrate warpage analysis during solder reflow process |
| title_sort | substrate warpage analysis during solder reflow process |
| topic | TK Electrical engineering. Electronics Nuclear engineering |
| work_keys_str_mv | AT behkehshin substratewarpageanalysisduringsolderreflowprocess |