Development of vapor pressure in fr4-copper composite material during solder reflow process
This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215 degrees C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite...
| Main Authors: | , , , , |
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| Format: | Article |
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2012
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