Effect of nickel doping on interfacial reaction between lead-free solder and ni-p substrate
Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study in...
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| Format: | Article |
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2012
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