Inline pin fin heat sink model and thermal performance analysis for central processing unit
The thermal management issue is common in electronic products such as computers, projectors and others. The trend shows that by increasing the power density, indirectly it will increase the temperature and power dissipation in CPU processor. This is a major challenge to the product designer of elect...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2015
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| Subjects: |