Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis
The objective of this research is to machine the silicon die of an IC chip and the surrounding chip packaging. The silicon die had to be reduced from a thickness of 85 ?m to about 50 ?m by a machining technique such that not a single transistor of the 40 million under the die is destroyed and at the...
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Elsevier B.V.
2007
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