Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass
In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished. The polishing process used on IC wafers is chemical mechanical polishing (CMP) that has in built facilities f...
| 主要な著者: | , , |
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| フォーマット: | 論文 |
| 出版事項: |
Elsevier B.V.
2004
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