Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
The increasing demand for high speed, high performance, robust and smaller packaging and high-power density leads to the need for an optimal electronic system design. These features will increase the thermal distribution of electronics components, which directly affect the lifespan of the electronic...
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| Format: | Thesis |
| Language: | English |
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2018
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| Online Access: | http://eprints.utm.my/78958/1/NurulKausarAbMajidMFKE2018.pdf |