Finite element analysis of material removal rate for Si wafer using heat-assisted µEDM
Micro-electrical discharge machining (µEDM) has been proved to produce high surface quality results in Si machining. In previous studies, the researchers reported the Si machining using the µEDM with several strategies such as plating, doping and temporary coating process to be machined by the µEDM....
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UTM Press
2021
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| Subjects: | |
| Online Access: | http://eprints.utm.my/97816/1/MohamedSultan2021_FiniteElementAnalysisofMaterialRemoval.pdf |