177816 Wong, M. H., & Mekanikal, F. K. (2006). Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource]. Skudai : Universiti Teknologi Malaysia.
Chicago Style aipamena177816 Wong, Mun Hon, and Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
MLA aipamena177816 Wong, Mun Hon, and Fakulti Kejuruteraan Mekanikal. Study of Dissolution Nickel Layer in Enig Surface Finish During Reflow Soldering [electronic Resource]. Skudai : Universiti Teknologi Malaysia, 2006.
Kontuz: berrikusi erreferentzia hauek erabili aurretik.