Application of high temperature electronics packaging technology to signal conditioning and processing circuits

Application of high temperature electronics packaging technology to signal conditioning and processing circuits

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibratio...

وصف كامل

التفاصيل البيبلوغرافية
المؤلفون الرئيسيون:	Riches, S, Cannon, K, Johnston, C, Sousa, M, Grant, P, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D, Firmstone, M
التنسيق:	Journal article
اللغة:	English
منشور في:	2010

مواد مشابهة

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