Application of high temperature electronics packaging technology to signal conditioning and processing circuits

Application of high temperature electronics packaging technology to signal conditioning and processing circuits

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibratio...

Полное описание

Библиографические подробности
Главные авторы:	Riches, S, Cannon, K, Johnston, C, Sousa, M, Grant, P, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D, Firmstone, M
Формат:	Journal article
Язык:	English
Опубликовано:	2010

Схожие документы

Assessment of the reliability of high temperature electronics packaging technology
по: Riches, S, и др.
Опубликовано: (2008)

Development of high temperature electronics packaging technology for long term operation at 250°C
по: Riches, S, и др.
Опубликовано: (2009)

High temperature endurance of packaged SOI devices for signal conditioning and processing applications
по: Riches, S, и др.
Опубликовано: (2011)

Assessing the reliability of die attach materials in electronic packages for high temperature applications
по: Sousa, M, и др.
Опубликовано: (2010)

High temperature Au-based solder reliability in electronic packages for harsh environments
по: Sousa, M, и др.
Опубликовано: (2011)

Realisation of high temperature electronics packaging technology for sensor conditioning and processing applications
по: Riches, S, и др.
Опубликовано: (2012)

Understanding die attach materials performance in electronic packages under harsh environments
по: Sousa, M, и др.
Опубликовано: (2010)

End of life failure modes for packaged SOI devices for signal conditioning and processing applications
по: Riches, S, и др.
Опубликовано: (2012)

Optimizing the performance of the Au-Si system for high temperature die attach applications
по: Sousa, M, и др.
Опубликовано: (2011)

Advances in electronic circuit packaging
по: International Electronic Circuit Packaging Symposium (1960 : Boulder)
Опубликовано: (1961)

Design and assembly of high temperature distributed aero-engine control system demonstrator
по: Riches, S, и др.
Опубликовано: (2014)

Electronic assembly fabrication : chips, circuit boards, packages, and components /
по: Harper, Charles A.
Опубликовано: (2002)

Integrated Circuit Packaging /
по: Gallardo, Fausto, author 639894
Опубликовано: (2012)

Electric circuit theory/
по: 412920 Riches, B. E.
Опубликовано: (1989)

Electronic circuits, signals and systems/
по: 183865 Mason, Samuel J., и др.
Опубликовано: (1960)

A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit
по: Zong Yao, и др.
Опубликовано: (2016-06-01)

Low temperature transient liquid phase bonding for electronic packaging
по: Hou, Michelle M. (Michelle Ming-Jan)
Опубликовано: (2011)

Circuits, interconnections, and packaging for VLSI /
по: 171718 Bakoglu, H. B.
Опубликовано: (1990)

Integrated circuit package antenna
по: Li, Wenbo.
Опубликовано: (2008)

Low temperature electronics : physics, devices, circuits and applications /
по: 378043 Gutierrez-D., Edmundo A., и др.
Опубликовано: (2001)

Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author’s Work
по: Sujan D., и др.
Опубликовано: (2018-01-01)

Integrated circuit packaging, assembly, and interconnections /
по: 223073 Greig, William J.
Опубликовано: (2007)

ANALOG ELECTRONICS : Circuits, Systems and Signal Processing /
по: Akanksha Dewaker, author, и др.
Опубликовано: (2018)

Simulation Analysis of Signal Conditioning Circuits for Plants’ Electrical Signals
по: Mirella Carneiro, и др.
Опубликовано: (2022-11-01)

Maize Seed Quality Evaluation at the Temperature Room Storage with Open Package Condition
по: Rahmawati Rahmawati, и др.
Опубликовано: (2019-10-01)

Signaling Circuits and Regulation of Immune Suppression by Ovarian Tumor-Associated Macrophages
по: Martin J. Cannon, и др.
Опубликовано: (2015-05-01)

The behaviour of Au-Au wire bonds in extreme environments
по: Shepherd, D, и др.
Опубликовано: (2010)

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /
по: 342034 Hwang, Jennie S.
Опубликовано: (1989)

Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly /
по: 342034 Hwang, Jennie S.
Опубликовано: (1992)

Electrical design of signal conditioning and signal processing circuit for Rogowski coil
по: Francis, Antony Denisha
Опубликовано: (2016)

Noise coupling analysis in integrated circuit packaging
по: Fernandus, Wylie
Опубликовано: (2015)

Solid state electronic control for air conditioning and refrigeration /
по: Langley, Billy C., 1931-
Опубликовано: (1989)

Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
по: Wang, Yuqi
Опубликовано: (2008)

Digital electronic circuits /
по: 180569 Glasford, Glenn M.
Опубликовано: (1988)

Miniaturized electronic circuit for amplification and wireless transmission of ECG signal [electronic resource] /
по: Lim, Ai Jia, 1990- , author
Опубликовано: (2014)

High temperature electronics in Europe
по: Johnston, C
Опубликовано: (2006)

Electronic and switching circuits /
по: Bozic, S. M. (Svetozar Mile), и др.
Опубликовано: (1975)

Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product [electronic resource] /
по: 452473 Cheah, Ui Ping
Опубликовано: (2007)

Novel integrated circuit pressed ceramic package antenna
по: Xue, Yang
Опубликовано: (2008)

Microcrack Detection And Noise Reduction In Integrated Circuit Packages
по: Koh, Ye Sheng
Опубликовано: (2018)