Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number

Owing to the toxicity of lead, much effort has been put in studies on lead-free solders after environmental legislations prohibited the use of lead in these parts worldwide. Here, Bi–Ag and Bi–Sb alternative solder alloys containing 1·5–5 wt-% Ag and Sb were investigated. The effect of the reflow nu...

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Bibliographic Details
Main Authors: Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.
Format: Article
Language:English
Published: W. S. Maney & Son 2014
Online Access:http://psasir.upm.edu.my/id/eprint/34236/1/Interfacial%20reaction%20of%20Bi%E2%80%93Ag%20and%20Bi%E2%80%93Sb%20solders%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf

Internet

http://psasir.upm.edu.my/id/eprint/34236/1/Interfacial%20reaction%20of%20Bi%E2%80%93Ag%20and%20Bi%E2%80%93Sb%20solders%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf

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