Quality improvement of solder paste printing process using six sigma methodology [compact disc] /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2005
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| Subjects: |
| _version_ | 1826441402400112640 |
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| author | 289882 Wong, Jing Hao |
| author_facet | 289882 Wong, Jing Hao |
| author_sort | 289882 Wong, Jing Hao |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 2005 |
| first_indexed | 2024-03-05T09:43:56Z |
| format | |
| id | KOHA-OAI-TEST:424745 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T09:43:56Z |
| publishDate | 2005 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:4247452020-12-19T17:14:55ZQuality improvement of solder paste printing process using six sigma methodology [compact disc] / 289882 Wong, Jing Hao Skudai : Universiti Teknologi Malaysia,2005engProject Paper (Sarjana Muda Kejuruteraan Mekanikal (Industri)) - Universiti Teknologi Malaysia, 200522PSZJBLProduction managementProcess controlSolder pastesSurface mount technology |
| spellingShingle | Production management Process control Solder pastes Surface mount technology 289882 Wong, Jing Hao Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title | Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title_full | Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title_fullStr | Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title_full_unstemmed | Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title_short | Quality improvement of solder paste printing process using six sigma methodology [compact disc] / |
| title_sort | quality improvement of solder paste printing process using six sigma methodology compact disc |
| topic | Production management Process control Solder pastes Surface mount technology |
| work_keys_str_mv | AT 289882wongjinghao qualityimprovementofsolderpasteprintingprocessusingsixsigmamethodologycompactdisc |