Solution for a modular die-level anodic bonder

Solution for a modular die-level anodic bonder

Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.

Bibliographic Details
Main Author: Khan, Christopher Joseph, 1982-
Other Authors: Alexander H. Slocum.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2006
Subjects:
Mechanical Engineering.
Online Access:http://hdl.handle.net/1721.1/32764

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