Heating dissipation discussion of TSV-integrated ion trap with glass interposer
In this work, we discuss the possible solutions to mitigate the temperature increase issue in TSV integrated ion trap with two approaches: (1) heat generation reduction, and (2) heat dissipation enhancement. We investigate the effect of electrical conductivity of silicon, grounding plane, number of...
Main Authors: | , , , , , , |
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Other Authors: | |
Format: | Conference Paper |
Language: | English |
Published: |
2024
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/175558 |