Heating dissipation discussion of TSV-integrated ion trap with glass interposer

Heating dissipation discussion of TSV-integrated ion trap with glass interposer

In this work, we discuss the possible solutions to mitigate the temperature increase issue in TSV integrated ion trap with two approaches: (1) heat generation reduction, and (2) heat dissipation enhancement. We investigate the effect of electrical conductivity of silicon, grounding plane, number of...

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Bibliographic Details
Main Authors: Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2024
Subjects:
Engineering
Heating systems
Electron traps
Online Access:https://hdl.handle.net/10356/175558

Internet

https://hdl.handle.net/10356/175558

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