Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package
As the packaging density in wafer-level packaging increases, there is an increasing need for packaging processes for fan-out packaged devices; thus, the soldering reliability of board-level devices is particularly important. Fan-out wafer-level packaging (FOWLP) is typically packaged using flip-chip...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-06-01
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| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330921000364 |