Rare earth materials for nanoelectronic applications

Rare earth materials for nanoelectronic applications

This report details the workdone on using rare earth materials for nanoelectronics applications. The aspects covered include formation of rare earth oxides for thin gate dielectrics, formation of rare earth based nanocrystals into rare earth oxides. The second part deals with the formation of rare e...

Fuld beskrivelse

Bibliografiske detaljer
Hovedforfatter:	Lee, Pooi See.
Andre forfattere:	School of Materials Science & Engineering
Format:	Research Report
Sprog:	English
Udgivet:	2009
Fag:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online adgang:	http://hdl.handle.net/10356/17234

Lignende værker

Through-silicon via fabrication with pulse-reverse electroplating for high density nanoelectronics
af: Lin, Nay, et al.
Udgivet: (2013)

Charge-induced conductance modulation of carbon nanotube field effect transistor memory devices
af: Chan, Mei Yin, et al.
Udgivet: (2013)

Processing and characterization of low-k materials for ULSI application
af: Widodo, Johnny.
Udgivet: (2008)

Novel high-k dielectrics for nanoelectronics
af: Chong, Vanessa Meng Meng
Udgivet: (2016)

Characterization of solder/UBM interface and materials properties
af: Ong, Kai Yie.
Udgivet: (2010)

Development and integration of new ultra low k materials & processes for high reliability microelectronics
af: Mhaisalkar, Subodh Gautam.
Udgivet: (2008)

Characterisation and applications of chemically amplified photoresists for DUV microlithography
af: Koh, Hui Peng.
Udgivet: (2008)

Development of wafer bonding technology for micro-electro-mechanical systems application
af: Wang, Lei.
Udgivet: (2008)

Investigation on the formation of C54-TiSi2 used as contact metallization in ULSI application
af: Zhang, Lin
Udgivet: (2008)

Characterization and structural modification of polysilsesquioxanes for low dielectric constant (k) applications in deep sub-micron devices
af: Siew, Yong Kong.
Udgivet: (2008)

Fabrication of metal oxide nanobranches on atomic-layer-deposited TiO2 nanotube arrays and their application in energy storage
af: Xia, Xinhui, et al.
Udgivet: (2013)

Anisotropic conductive adhesive for micro joining in semiconductor interconnects application (solder alternative for fine pitch & environment friendly IC packaging)
af: Goh, Chin Foo
Udgivet: (2008)

Introduction to the physics of nanoelectronics /
af: Tan, Seng Ghee, et al.
Udgivet: (2012)

Physical properties of 1-D ZnO-based nanostructures
af: Pang, Christina Ai Lin
Udgivet: (2009)

Evaluation of process requirements for room temperature direct copper bonding
af: Chen, Qiang.
Udgivet: (2009)

Synthesis and structural study of poly(ethylene napthalate) (PEN)/clay nanocomposites
af: Lu, Xuehong.
Udgivet: (2009)

Fine pitch packaging study of CU or low-k devices
af: Ong, Xuefen.
Udgivet: (2009)

Effects of strain/stress on quantum dots and nano-devices.
af: Shen, Zexiang.
Udgivet: (2009)

Nanomaterials : synthesis, processing and characterization
af: Boey, Freddy Yin Chiang.
Udgivet: (2009)

Electrical characterization of three-dimensional graphene infused polymers
af: Ho, Roderick Zhan Feng
Udgivet: (2017)

Dielectric failure mechanisms in advanced Cu/low-k interconnect architecture
af: Tan, Tam Lyn
Udgivet: (2008)

Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints
af: Siow, Kim Shyong.
Udgivet: (2008)

Synthesis and characterization of metal silicides nanostructures
af: Li, Shaozhou.
Udgivet: (2013)

Modeling of electromigration failure under pulsed current conditions in confined copper interconnect
af: Lin, Jingyuan.
Udgivet: (2010)

Study of femtosecond laser pulse drilling of silicon
af: Jiao, Lishi
Udgivet: (2015)

Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth
af: Nai, S. M. L., et al.
Udgivet: (2010)

Electrical characterization of copper-based nanowire
af: Pah, Hazel Pei Lin
Udgivet: (2012)

The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects
af: Ang, Derrick, et al.
Udgivet: (2011)

Synthesis of graphene and carbon nanotube composite by chemical vapor deposition
af: Yu, Hong.
Udgivet: (2011)

Back-end-of-line process reliability of advanced semiconductor technology
af: Park, Hun Sub.
Udgivet: (2008)

Electromigration reliability study on copper interconnects under pulsed current conditions
af: Lim, Meng Keong
Udgivet: (2015)

Experimental and theoretical approaches to investigating bulk and nanoscale properties of ferroelectrics
af: Ng, Nathaniel
Udgivet: (2008)

Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects
af: Ang, Derrick, et al.
Udgivet: (2011)

Cu metallization and dielectric removal for failure analysis of ICs
af: Siah, Yu Wen.
Udgivet: (2012)

Working mechanism for a redox switchable molecular machine based on cyclodextrin : a free energy profile approach
af: Zhang, Qiong, et al.
Udgivet: (2011)

Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
af: Kithva Prakash Hariram.
Udgivet: (2008)

Investigating the electromigration reliability of copper interconnects
af: Shao, Wei
Udgivet: (2010)

Development of metal silicides for deep submicron polycrystalline silicon gate
af: Pang, Chong Hau
Udgivet: (2008)

Study of electromigration-induced voiding mechanisms in Cu interconnects
af: Anand Vishwanath Vairagar
Udgivet: (2010)

Electromigration behaviour of copper metal lines in ULSI devices
af: Ong, Sock Meng.
Udgivet: (2008)