Low temperature thermocompression bonding of copper-copper bumps using gold alloy nanoparticles
One of the key methods to form interconnects between electrical packages and devices is by thermocompression bonding. The reliability of these metallic interconnects are often dictated by bonding parameters like temperature, time and pressure. Copper (Cu) which possesses outstanding mechanical, elec...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/10356/48405 |