Characterization of bonded copper interconnects for three-dimensional integrated circuits

Characterization of bonded copper interconnects for three-dimensional integrated circuits

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2002.

Bibliographic Details
Main Author: Tadepalli, Rajappa, 1979-
Other Authors: Carl V. Thompson.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2005
Subjects:
Materials Science and Engineering.
Online Access:http://hdl.handle.net/1721.1/8428

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